Topright Rigid PCB Capability
| Item | Manufacture Capability |
|---|---|
| Layers | 1-50 Layers |
| HDI | 5+N+5 |
| Impedance Controlled | Min +/-5%, General+/-10% |
| Material Types | Fr-4, Fr-5, High-Tg, Aluminum, Copper PCB, Halogen Free, Carbon PCB |
| Material | Isola, Taconic, Arlon, Teflon, Rogers |
| Max. Panel Dimension | 35000mil * 47000mil (1000mm * 1200mm) |
| Min. Panel Size | 24mil (0.6mm) |
| Board Thickness | 8mil-480mil (0.2 - 12mm) |
| Board Thickness Tolerance | ±10% |
| Dielectric Thickness | 3mil-8mil (0.075mm-0.20mm) |
| Min. Track Width | 3mil (0.075mm) |
| Min. Track Space | 3mil (0.075mm) |
| External Cu Thickness | 0.5 OZ - 40 OZ (17um - 1400um) |
| Internal Cu Thickness | 0.5OZ - 15 OZ (17um - 525um) |
| Drilling Size (CNC) | 6mil-256mil (0.15mm - 6.50mm) |
| Finished Hole Dimension | 4mil-236mil(0.1mm - 6.0mm) |
| Hole Tolerance | ±2mil (±0.05mm) |
| Laser Drilling Hole Size | 4mil(0.1mm) |
| Aspect Ration | 16:01 |
| Solder Mask | Green, Blue, White, Black, Red, Yellow, Purple, etc. |
| Solder mask Bridge | 2mil(0.050mm) |
| Plugged Hole Diameter | 8mil-20mil (0.20mm-0.50mm) |
| Scoring | ±0.25 mm, 15°30°45° |
| Beveling | 20-45 Deg |
| Surface Finishing | HASL, HASL(Lead Free), ENIG(Gold 1 U"~10 U"), Immersion Silver, Immersion Tin, OSP, Hard Gold (up to 100u") |
| Certification | UL RoHS ISO9001 SGS |
| Inspect Standard | IPC 6012B Class 2, IPC 6012B Class 3 |
| Testing | Flying probe, E-TEST, X-RAY Inspection, AOI |
| Files | Gerber Protel DXP Auto CAD PADS OrCAD Express PCB etc |